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LM386 Low Voltage Audio Power Amplifier

August 2000

LM386 Low Voltage Audio Power Amplifier
General Description
The LM386 is a power amplifier designed for use in low voltage consumer applications. The gain is internally set to 20 to keep external part count low, but the addition of an external resistor and capacitor between pins 1 and 8 will increase the gain to any value from 20 to 200.The inputs are ground referenced while the output automatically biases to one-half the supply voltage. The quiescent power drain is only 24 milliwatts when operating from a 6 volt supply, making the LM386 ideal for battery operation.

n n n n n n n n Battery operation Minimum external parts Wide supply voltage range: 4V–12V or 5V–18V Low quiescent current drain: 4mA Voltage gains from20 to 200 Ground referenced input Self-centering output quiescent voltage Low distortion: 0.2% (AV = 20, VS = 6V, RL = 8Ω, PO = 125mW, f = 1kHz) n Available in 8 pin MSOP package

n n n n n n n n AM-FM radio amplifiers Portable tape player amplifiers Intercoms TV sound systems Line drivers Ultrasonic drivers Small servo drivers Power converters

Equivalent Schematic andConnection Diagrams
Small Outline, Molded Mini Small Outline, and Dual-In-Line Packages



Top View Order Number LM386M-1, LM386MM-1, LM386N-1, LM386N-3 or LM386N-4 See NS Package Number M08A, MUA08A or N08E

© 2000 National Semiconductor Corporation




Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices arerequired, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (LM386N-1, -3, LM386M-1) Supply Voltage (LM386N-4) Package Dissipation (Note 3) (LM386N) (LM386M) (LM386MM-1) Input Voltage Storage Temperature Operating Temperature Junction Temperature Soldering Information 15V 22V 1.25W 0.73W 0.595W ± 0.4V −65˚C to +150˚C 0˚C to +70˚C+150˚C

Dual-In-Line Package Soldering (10 sec) +260˚C Small Outline Package (SOIC and MSOP) Vapor Phase (60 sec) +215˚C Infrared (15 sec) +220˚C See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. Thermal Resistance 37˚C/W θJC (DIP) 107˚C/W θJA (DIP) 35˚C/W θJC (SO Package) 172˚C/W θJA (SO Package) 210˚C/W θJA(MSOP) 56˚C/W θJC (MSOP)

Electrical Characteristics (Notes 1, 2)
TA = 25˚C Parameter Operating Supply Voltage (VS) LM386N-1, -3, LM386M-1, LM386MM-1 LM386N-4 Quiescent Current (IQ) Output Power (POUT) LM386N-1, LM386M-1, LM386MM-1 LM386N-3 LM386N-4 Voltage Gain (AV) Bandwidth (BW) Total Harmonic Distortion (THD) Power Supply Rejection Ratio (PSRR) Input Resistance (RIN) Input Bias Current (IBIAS)VS = 6V, Pins 2 and 3 Open
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electricalspecifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 3: For operation in ambient temperatures above 25˚C, the device must be derated based on a 150˚Cmaximum junction temperature and 1) a thermal resistance of 107˚C/W junction to ambient for the dual-in-line package and 2) a thermal resistance of 170˚C/W for the small outline package.


Min 4 5


Max 12 18

Units V V mA mW mW mW dB dB kHz % dB kΩ nA

VS = 6V, VIN = 0 VS = 6V, RL = 8Ω, THD = 10% VS = 9V, RL = 8Ω, THD = 10% VS = 16V, RL = 32Ω, THD = 10% VS = 6V, f = 1 kHz...
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