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LPC3152/3154
Rev. 0.12 — 27 May 2010

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ARM926EJ microcontrollers with USB High-speed OTG, SD/MMC, NAND flash controller, and audio codec
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Preliminary data sheet
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1. Generaldescription
The NXP LPC3152/3154 combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0 OTG, 192 kB SRAM, NAND flash controller, flexible external bus interface, an integrated audio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallel interfaces in a single chip targeted at consumer, industrial, medical, and communication markets. To optimize system power consumption, theLPC3152/3154 have multiple power domains and a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling. The LPC3152/3154 are implemented as a multi-chip module with two side-by-side dies, one for digital functions and one for analog functions, which include Power Supply Unit (PSU), audio codec, RTC, and Li-ion battery charger.

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2. Features and benefits2.1 Key features
CPU platform 180 MHz, 32-bit ARM926EJ-S 16 kB D-cache and 16 kB I-cache Memory Management Unit (MMU) Internal memory 192 kB embedded SRAM External memory interface NAND flash controller with 8-bit ECC and AES decryption engine (LPC3154 only) 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM Security AES decryption engine (LPC3154 only) Secure one-time programmablememory for AES key storage and customer use 128 bit unique ID per device for DRM schemes Communication and connectivity High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY Two I2S-bus interfaces Integrated master/slave SPI Two master/slave I2C-bus interfaces Fast UART Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA

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LPC3152/3154
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Three-channel 10-bit ADC Integrated 4/8/16-bit 6800/8080 compatible LCD interface Integrated audio codec with stereo ADC and Class AB headphone amplifier System functions Dynamic clock gating and scaling Multiple power domains Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB On the LPC3154 only: secure booting using AESdecryption engine from SPI flash, NAND flash, SD/MMC cards, UART, or USB DMA controller Four 32-bit timers Watchdog timer PWM module Master/slave PCM interface Random Number Generator (RNG) General Purpose I/O (GPIO) pins Flexible and versatile interrupt structure JTAG interface with boundary scan and ARM debug access Real-Time Clock (RTC) Power supply Integrated power supply unit Li-ion charger USB chargepump Operating voltage and temperature Core voltage: 1.2 V I/O voltage: 1.8 V, 3.3 V Temperature: −40 °C to +85 °C TFBGA208 package: 12 × 12 mm2, 0.7 mm pitch
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3. Ordering information
Table 1. Ordering information Package Name LPC3152FET208 LPC3154FET208 Description Version sot930-1sot930-1 TFBGA208 TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm TFBGA208 TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm Type number

LPC3152_3154

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Preliminary data sheet

Rev. 0.12 —27 May 2010

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3.1 Ordering options
Table 2. Ordering options for LPC3152/54 Total SRAM NAND Security High-speed 10-bit Audio Flash engine USB ADC codec, Controller AES channels PSU, RTC, Li-ion charger...