Caracteristicas Del Diodo Zener

1PMT5920B Series 3.2 Watt Plastic Surface Mount POWERMITE® Package
This complete new line of 3.2 Watt Zener Diodes are offered in highly efficient micro miniature, space saving surface mount with its unique heat sink design. The POWERMITE package has the same thermal performance as the SMA while being 50% smaller in footprint area and delivering one of the lowest height profiles (1.1 mm) in theindustry. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines and many other industrial/consumer applications.
Specification Features: http://onsemi.com

PLASTIC SURFACE MOUNT 3.2 WATT ZENER DIODES 6.2 − 47 VOLTS

• • • • • • • • •

Zener Breakdown Voltage: 6.2 − 47 Volts DC Power Dissipation: 3.2 Watts with Tab 1 (Cathode) @ 75°C LowLeakage < 5 mA ESD Rating of Class 3 (> 16 kV) per Human Body Model Low Profile − Maximum Height of 1.1 mm Integral Heat Sink/Locking Tabs Full Metallic Bottom Eliminates Flux Entrapment Small Footprint − Footprint Area of 8.45 mm2 Supplied in 12 mm Tape and Reel T1 = 3,000 Units per Reel T3 = 12,000 Units per Reel • POWERMITE is JEDEC Registered as DO−216AA • Cathode Indicated by Polarity BandMechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are

1 1: CATHODE 2: ANODE

2

1

2 POWERMITE CASE 457 PLASTIC

MARKING DIAGRAM
D 2 ANODE

readily solderable
MOUNTING POSITION: Any MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

1 CATHODE xxB xx D

xxB

260°C for 10 Seconds

=Specific Device Code = 20 − 41 = (See Table Next Page) = Date Code

ORDERING INFORMATION
Device Package Shipping

1PMT59xxBT1 POWERMITE 3,000/Tape & Reel 1PMT59xxBT3 POWERMITE 12,000/Tape & Reel

LEAD ORIENTATION IN TAPE: Cathode (Short) Lead to Sprocket Holes

© Semiconductor Components Industries, LLC, 2003

1

July, 2003 − Rev. 0

Publication Order Number: 1PMT5920B/D

1PMT5920BSeries
MAXIMUM RATINGS
Rating DC Power Dissipation @ TA = 25°C (Note 1) Derate above 25°C Thermal Resistance from Junction to Ambient Thermal Resistance from Junction to Lead (Anode) Maximum DC Power Dissipation (Note 2) Thermal Resistance from Junction to Tab (Cathode) Operating and Storage Temperature Range 1. Mounted with recommended minimum pad size, PC board FR−4. 2. At Tab (Cathode)temperature, Ttab = 75°C Symbol °PD° RqJA RqJanode °PD° RqJcathode TJ, Tstg Value 500 4.0 248 35 3.2 23 −55 to +150 Unit °mW mW/°C °C/W °C/W W °C/W °C

ELECTRICAL CHARACTERISTICS (TL = 25°C unless otherwise noted, VF = 1.5 V Max. @ IF = 200 mAdc for all types)
Symbol VZ IZT ZZT IZK ZZK IR VR IF VF Parameter Reverse Zener Voltage @ IZT Reverse Current Maximum Zener Impedance @ IZT Reverse CurrentMaximum Zener Impedance @ IZK Reverse Leakage Current @ VR Reverse Voltage Forward Current Forward Voltage @ IF VZ VR

I IF

IR VF IZT

V

Zener Voltage Regulator

ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
Zener Voltage (Note 3) Device Marking 20B 21B 22B 23B 24B 25B 27B 29B 30B 31B 33B 34B 35B 36B 39B 41B VZ @ IZT (Volts) Min 5.89 6.46 7.12 7.798.64 9.5 11.4 14.25 15.2 17.1 20.9 22.8 25.65 28.5 37.05 44.65 Nom 6.2 6.8 7.5 8.2 9.1 10 12 15 16 18 22 24 27 30 39 47 Max 6.51 7.14 7.88 8.61 9.56 10.5 12.6 15.75 16.8 18.9 23.1 25.2 28.35 31.5 40.95 49.35 IZT (mA) 60.5 55.1 50 45.7 41.2 37.5 31.2 25 23.4 20.8 17 15.6 13.9 12.5 9.6 8.0 IR @ VR (mA) 5.0 5.0 5.0 5.0 5.0 5.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 VR (V) 4.0 5.2 6.0 6.5 7.0 8.09.1 11.4 12.2 13.7 16.7 18.2 20.6 22.8 29.7 35.8 ZZT @ IZT (Note 4) (W) 2.0 2.5 3.0 3.5 4.0 4.5 6.5 9.0 10 12 17.5 19 23 28 45 67 ZZK @ IZK (Note 4) (W) 200 200 400 400 500 500 550 600 600 650 650 700 700 750 900 1000

IZK (mA) 1.0 1.0 0.5 0.5 0.5 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25

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