Conecctor

26th July 1998 QS/PSN/TR/018 - 10 SD

10 SD Modular Connector
Technical Report

Tekmate 

Technical Report
10 Pair Modular Wire Connector
Document No: QS/PSN /TR/018 - 10SD Issue: 1 Revision: 1

TEK Components
Page 2 of 15 Dated: July 26, 1998

IMPORTANT NOTICE This technical report is published by TEK Components Pvt Ltd (TEK) to inform the potential Users on the performance ofthe products described herein. All statements, technical information related to the products are based on the information and test data believed to true and reliable. However the completeness of this report is not guaranteed. The User clients are advised to verify the suitability of the product for their intended use. TEK MAKES NO RERESENTATION OR WAARENTY EXPRESSED OR IMPLIED WITH RESPECT TOSUFFICIENCY, ACCURACY, OR UTILITY OF ANY INFORMATION OR OPINION CONTAINED HEREIN, UNLESS AGREED BY CONTRACT DULY SIGNED BY AN AUTHORIZED OFFICER OF TEK. TEK EXPRESSLY ADVISES THAT ANY USE OF OR RELIANCE UPON THE INFORMATION OR OPINION IS AT THE RISK OF THE USER AND THAT TEK SHALL NOT BE LIABLE FOR ANY DIRECT OR CONSEQUENTAL DAMAGES OR INJURY INCURRED BY ANY PERSON ARISING OUT OF THE SUFFICIENCY,ACCURACY OR UTILITY OF ANY INFORMATION OR OPINION CONTAINED HEREIN. TEK reserves the right to revise this document for any reason including but not limited to conformity with standards promulgated by various agencies, utilization of advancement of technology in the design of products, techniques or procedures described or referred to herein. For further information, please contact: Director – Technical,TEK Components Pvt Ltd, EL 31/15, J Block, MIDC, Bhosari, Pune, INDIA 411 026. (T) 91 20 712 1029. E-mail: tekelec@pn2.vsnl.net.in

Technical Report
10 Pair Modular Wire Connector
Document No: QS/PSN /TR/018-10SD Issue: 1 Revision: 1

TEK Components
Page 3 of 15 Dated: July 26, 1998

CONTENTS: 1. Introduction……………………………………………………………………………………………. 4 2. GeneralInformation………………………………………………………………………………… 4 2.1 2.2 2.3 2.4 2.5 Product Description……………………………………………………………………………..4 Design Features………..………………………………………………………………………..5 Material and Finishes……………………………………………………………………………5 Application & Range.……………………………………………………………………………6 Application Tools…………………………………………………………………………………6

3.0 Test Program…………………………………………………………………………………………..7 4.0 Test Results…………………………………………………………………………………………….8 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.94.10 4.11 4.12 4.13 4.14 4.15 Tensile Strength..………………………………………………………………………………..8 Torsion…………..…………………………………………………………………………………..8 Bending………………………………………………………………………………………………9 Connection Resistance.………………….…………………………………………………….9 Dielectric Strength………………………………………………………………………………10 High Voltage Surge……………………………………………………………………………..10 Insulation Resistance (Dry)………………………………………………………………….11 InsulationResistance (Immersion)……………………………………………………….11 Insulation Resistance (Temp cycling with Humidity)……………….……………..12 Connection Resistance (Temperature Cycling)……………………………………….12 Connection Resistance (Temp Cycling with Humidity)……….……………………13 Connection Resistance (Stress Relaxation)………………………….…………………13 Connection Resistance (Thermal Shock)………………………………………………..14 Connection Resistance (Salt fogexposure)…………………………………………….14 Connection Resistance (Vibration)…………………………………………………………15

Technical Report
10 Pair Modular Wire Connector
Document No: QS/PSN /TR/018 -10SD Issue: 1 Revision: 1

TEK Components
Page 4 of 15 Dated: July 26, 1998

1. INTRODUCTION 1.1 Purpose And Scope Of Document
This document outlines brief description of TEK TC 018 series 10 pair modular connector with applicableaccessories and performance of the product under stimulated environment. Qualification of the connector as per this specification and test procedures will ensure product function and reliability for 40 or more years, enduring harsh climatic conditions in the outside plant.

2.0 2.1

GENERAL INFORMATION Product Description
The product, TC 018 series...