Data Sheet

Data sheet acquired from Harris Semiconductor SCHS052B – Revised June 2003

The CD4067B and CD4097B types are supplied in 24-lead hermetic dual-in-line ceramic packages (F3A suffix), 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96, and NSR suffixes), and 24-lead thin shrink small-outline packages (P and PWR suffixes).

Copyright  2003, TexasInstruments Incorporated

PACKAGE OPTION ADDENDUM
www.ti.com

28-Feb-2005

PACKAGING INFORMATION
Orderable Device CD4067BE CD4067BF CD4067BF3A CD4067BM CD4067BM96 CD4067BNSR CD4067BPW CD4067BPWR CD4097BE CD4097BF CD4097BM CD4097BM96 CD4097BNSR CD4097BPW CD4097BPWR
(1)

Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVEPackage Type PDIP CDIP CDIP SOIC SOIC SO TSSOP TSSOP PDIP CDIP SOIC SOIC SO TSSOP TSSOP

Package Drawing N J J DW DW NS PW PW N J DW DW NS PW PW

Pins Package Eco Plan (2) Qty 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 15 1 1 25 2000 2000 60 2000 15 1 25 2000 2000 60 2000 Pb-Free (RoHS) None None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) NonePb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)

Lead/Ball Finish CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1YEAR/ Level-1-235C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM Level-NC-NC-NC Level-NC-NC-NC Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device willbe discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - May not becurrently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% byweight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)

MSL, Peak Temp. -- TheMoisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracyof such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and...