Datasheet
Páginas: 2 (496 palabras)
Publicado: 19 de mayo de 2012
Data sheet acquired from Harris Semiconductor SCHS115A – Revised November 1999
The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package (F suffix), 14-lead dual-in-lineplastic package (E suffix), 14-lead dual-in-line plastic small-outline package (M), and in chip form (H suffix). Add the suffix 96 to the M package for tape and reel.
PACKAGE THERMAL IMPEDANCE, θJA(See Note 1): E package . . . . . . . . . . . . . . . . . . . . . . . M package . . . . . . . . . . . . . . . . . . . . . . .
............................ ............................
80°C/W86°C/W
NOTE 1:
Package thermal impedance is calculated in accordance with JESD 51.
VDD
VDD
VOH
VP VN VOL
VSS
PRODUCTION DATA information is current as of publication date. Productsconform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 1999, Texas InstrumentsIncorporated
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
4
POST OFFICEBOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or servicewithout notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrantsperformance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the...
The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package (F suffix), 14-lead dual-in-lineplastic package (E suffix), 14-lead dual-in-line plastic small-outline package (M), and in chip form (H suffix). Add the suffix 96 to the M package for tape and reel.
PACKAGE THERMAL IMPEDANCE, θJA(See Note 1): E package . . . . . . . . . . . . . . . . . . . . . . . M package . . . . . . . . . . . . . . . . . . . . . . .
............................ ............................
80°C/W86°C/W
NOTE 1:
Package thermal impedance is calculated in accordance with JESD 51.
VDD
VDD
VOH
VP VN VOL
VSS
PRODUCTION DATA information is current as of publication date. Productsconform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 1999, Texas InstrumentsIncorporated
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
4
POST OFFICEBOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or servicewithout notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrantsperformance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the...
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