Igbts

Contents
Modules MiniSKiiP® 3-level IGBT Modules SEMiX® SEMiX® SEMITRANS® SKiM® SKiM® 63 / 93 SKiM® 4 / 5 MiniSKiiP® MiniSKiiP® SEMITOP® MiniSKiiP® IPM MiniSKiiP® SKiiP® 4th generation SKiiP® 3 / 4 MiniSKiiP® SEMITOP® SEMITRANS® SEMITOP® SEMiX® SEMIPACK® SEMIPACK® Fast SEMITOP® SEMIPONT® SEMiSTART® SEMiX® MiniSKiiP® SEMIPONT® SEMITOP® Power Bridge Fast-on Leaded Leaded Surface Mount Stud ScrewFit Capsule Stud Screw Fit Capsule SEMICELL SKYPER® SEMIDRIVER SKAITM2 SKAITM2 SEMiXBOX SEMIKUBE SKiiPRACK SEMISTACK®RE SEMISTACK Renewable Energy CLASSICS Heatsinks Fans 2 3 4 5 9 14 15 16 17 18 19 24 25 26 27 28 36 37 39 40 41 42 44 45 46 51 52 53 54 55 56 57 58 61 62 63 64 65 66 69 72 74 75 76 77 80 81 83 84 85 86 92 94 96 97 98 99 100 103 105
1

IPM - Intelligent Power Modules

CIB -Converter Inverter Brake Modules MOSFET Modules Thyristor / Diode Modules

Bridge Rectifier

Miniature Bridge Rectifier Discretes

Diodes

Thyristor Chips Driver Electronics SKIN® Systems for e-Vehicles Solutions

Accessories

MiniSKiiP 3-level
®

A new dimension of power density in multilevel applications

Applications
The MiniSKiiP 3-level power modules are most suitable forapplications requiring a high level of efficiency and a better output waveform quality, e.g. for uninterruptible power supply systems (UPS) and solar inverters. Especially at switching frequencies above 8 kHz, the 3-level topology provides reduction of overall losses up to 40% compared to a conventional 2-level solution.

Benefits
The MiniSKiiP 3-level power modules combine all electrical advantagesof 3-level topology with a well-established MiniSKiiP mechanical concept consisting of pressure contact technology for quick and easy solder-free assembly. While a soldered module is assembled in a time consuming production process requiring expensive automatic soldering equipment, MiniSKiiP 3-level power modules will be assembled in one step without costly special equipment.

Product range
TheMiniSKiiP 3-level power modules are available up to 200A in NPC (Neutral Clamping Point) topology and in the MiniSKiiP housing sizes 2 and 3. All modules are featuring Trench Field Stop IGBT4 with a blocking voltage of 650 V and SEMIKRON CAL I4F diodes.

2

IGBT Modules
SEMiX®
half bridge 6-pack chopper

75A

600V/1200V/1700V

600A

SEMITRANS®
half bridge 6-pack chopper singleswitch

35A

600V/1200V/1700V

900A

SKiM® 63 /93
6-pack 3-level

600V/1200V/1700V 300A 900A

SKiM® 4 /5
6-pack 3-level

650V/1200V/1700V 200A 600A

MiniSKiiP®
6-pack 3-level

8A

600V/1200V 200A

SEMITOP®
half bridge 6-pack 3-level chopper single switch

600V/1200V 10A 200A

ICnom [A]

8 10 35

75

200 300

600 900

3

SEMiX

®

IGBT and rectifiermodule family for solder-free assemblies

Applications
SEMiX is a flexible and application-oriented module. On the basis of a scalable platform concept, modern chip technology is integrated into IGBT and rectifier modules, which are used in a wide variety of applications such as AC motor drives, switching power supplies and current source inverters. Other typical applications are matrix converters,uninterruptible power supplies and electronic welding devices.

Benefits
• • • • • • • • Fast assembly in one direction from above Solder-free connection to control unit using reliable spring contacts Separation of control unit, AC and DC terminals Direct driver assembly Same-height (17 mm) IGBT and rectifier modules Flat and compact inverter design Optimized production at customer site Easyservicing

Product range
Six different housing sizes are available in the voltage classes 600 V, 1200 V and 1700 V for IGBT modules. Half-bridge, six-pack and chopper topologies are available for a current range of 75 A to 600 A. Besides IGBT3 and IGBT4 chips, the 1200 V range now also includes a new series with V-IGBT devices. Controlled, half-controlled and uncontrolled rectifier modules with...