Ingeniero

Páginas: 2 (374 palabras) Publicado: 30 de julio de 2012
Product Description
BGA Repair System SP360C- best seller with good cost performance --- one popular model saving cost for customer 

Warranty: 
1 year warranty, during which, if parts get brokennaturally, not artificially, we will replace one part for u and the shipping cost is on our party. 

Features 
1, High quality heating material produces high-tem breeze, precisely controlling thesoldering and desoldering process. 
2, horizontally-movable heating head for easy operation; 
3, Embedded industrial computer, touch screen interface, real-time temperature curve display, able todisplay set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation; 
4, Industrial computer able to store unlimited temperature curves, curve analysiscan be done on touch screen; Both English and Chinese can be input; 
5, The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; Bottom constanttemperature infrared heating area; Appropriate temperature control apparatus can ensure safe rework for BGA; 

6, The BGA soldering supporting frame can micro-adjusted to avoid local sinkage; 
7,Powerful cross flow fan can cool the lower heating area; 
8, The adjustable PCB positioning supports, easy and fast to install PCB; Special fixture for installing allotype boards; 
9, with sound alarmingfunction after finishing soldering or desoldering; Hand vacuum pen easy for picking up BGA; 
10, Set with over temperature alarming and protection function; 
11, Equipped with different hot gasnozzles, easy to replace and be customized 
12, The integrated design of machine and chassis, room-saving.
Max PCB Size | 430mm*350mm |
Max BGA Size | 55mm*55mm |
Min BGA Size | 7mm*7mm |
Maxweight | 80g |
Power for operation | 3800W |
Main Heater | hot air, 600W |
Lower hater | hot air, 800W |
Bottom heater | far infrared, 2400W |
Machine dimension | 650*500*600mm |
Machine...
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