Ipc-610-Rev E

IPC-A-610E-2010
®

Acceptability of Electronic
Assemblies

Developed by the IPC-A-610 development team including Task Group
(7-31b), Task Group Asia (7-31bCN) and Task Group Nordic (7-31bND)
of the Product Assurance Committees (7-30 and 7-30CN) of IPC

Supersedes:
IPC-A-610D - February 2005
IPC-A-610C - January 2000
IPC-A-610B - December 1994
IPC-A-610A - March 1990
IPC-A-610 -August 1983

Users of this publication are encouraged to participate in the
development of future revisions.
Contact:
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105

Table of Contents
1

Foreword ...................................................................... 1-1

2

Applicable Documents............................................... 2-1

1.1

Scope ......................................................................... 1-2

2.1

IPC Documents ........................................................ 2-1

1.2

Purpose ..................................................................... 1-3

2.2

Joint Industry Documents ..................................... 2-1

1.3

Classification........................................................... 1-3

2.3

EOS/ESD Association Documents ....................... 2-2

1.4

Definition of Requirements ................................... 1-3

2.4

Electronics Industries Alliance Documents ....... 2-2

2.5

International Electrotechnical Commission
Documents ................................................................2-2

2.6

ASTM ......................................................................... 2-2

2.7

Technical Publications ........................................... 2-2

1.4.1
1.4.1.1
1.4.1.2
1.4.1.3
1.4.1.3.1
1.4.1.4
1.4.1.4.1
1.4.1.5
1.4.1.6
1.4.1.7
1.5

Acceptance Criteria ..........................................
Target Condition..............................................
Acceptable Condition .......................................
Defect Condition ..............................................
Disposition .......................................................
Process Indicator Condition .............................
Process Indicator Methodologies .....................
Combined Conditions ......................................
Conditions NotSpecified .................................
Specialized Designs .........................................

1-3
1-3
1-4
1-4
1-4
1-4
1-4
1-4
1-4
1-4

Terms & Definitions ................................................ 1-4

1.5.1
1.5.1.1
1.5.1.2
1.5.1.3
1.5.1.4
1.5.2
1.5.3
1.5.4
1.5.5
1.5.6
1.5.7
1.5.8
1.5.9
1.5.10
1.5.11
1.5.12

Board Orientation.............................................
*Primary Side ....................................................
*Secondary Side ...............................................
Solder Source Side ..........................................
Solder Destination Side ....................................
*Cold Solder Connection ...................................
Electrical Clearance..........................................
High Voltage ....................................................
Intrusive Solder ................................................
*Leaching ..........................................................
Meniscus (Component) ....................................
*Nonfunctional Land ..........................................
Pin-in-Paste.....................................................
Wire Diameter ..................................................
Wire Overwrap .................................................
Wire Overlap ....................................................

1-4
1-5
1-5
1-5
1-5
1-5
1-5
1-5
1-5
1-5
1-5
1-5
1-5
1-5
1-5
1-5

1.6

Examples and Illustrations .................................... 1-5

1.7

Inspection Methodology...