Procedimiento estandar de operaciones

1. DESCRIPTION AND APPROVALS


Objetivo : | Este documentoThis document defines the minimum requirements that must be followed in all the wave soldering process at the Thomson Mexico Plants.SOP must be the formal guidelines for the key process carried out at Manufacturing plants; they must be written under the outlines of “What to do”, responsibilities toperform the job and how often will be performed |
Scope : | Mexico Operations under SBU Americas and Multimedia |
Related Documents : | 1. ISO-9000 documents related to Wave Soldering Process.
2. IPC standards. J-STD-001B “Requirements for Soldered Electrical and Electronic Assemblies”, and IPC-A-610B “Acceptability of Electronic Assemblies”.3. IPC standard IPC-7912 “Calculation of DPMO andManufacturing Indices for Printed Circuit Assemblies” |
Records : | |



| Title | Name | Signature | Date |
Originators | | Alejandro Becerra/Hector Camacho | | Feb 1st 2001 |
Approved by: | Mexico Operations Quality Director | Pablo Lozano | | |
| Mexico Operations Manufacturing Director |Guillermo Gonzalez | | |


This is a controlled document, it only can be official if it is printed on blue sheets and with the Thomson logo on the background. Printed in any other kind of sheets is only for reference. The official documentation is located on the MSC QA server

2. INDEX

1. Description and Approvals 1

2. Index 2

3. Revisions History4

4. Definitions 5

5. General Procedures 6
6.1 Process Activities
6.2 Process Parameters
6.3.1 Fluxing Parameters
6.3.2 Preheating parameters
6.3.3 Wave Solder Parameters
6.3 Maintenance Activities
6.4.4 Daily Maintenance Activities
6.4.5 Preventive Maintenance Activities
6.4.6.1 PreventiveMechanical Maintenance
6.4.6.2 Preventive Electrical Maintenance

6. Process Criteria 12
7.4 Acceptability Criteria
7.5.6 Acceptable Solder Conditions
7.5.7 Through-Hole Connections
7.5.8 Surface Soldering of Lead Terminations (SMD components)
7.5 Solder Joint Defects
7.6.9 Fractured Solder Joints
7.6.10 Disturbed andCold Solder Joints
7.6.11 Excess Solder Joints
7.6.12 Solder Bridges
7.6.13 Insufficient Solder
7.6.14 Non-wetting
7.6.15 Non Soldered

7. Process Measurements 15
8.6 Contribution to Clear Ticket Loss
8.7 Down Time
8.8 CAL
8.9 Paretos
8.10 DPMOs
8.11 Cross-Section Analysis

8. Process Resources17
9.12 Human Resources
9.13.16 Wave Solder Engineer
9.13.17 Wave Solder Technician
9.13.18 Wave Solder Group Leader
9.13.19 Solder Quality Inspector
9.13 Equipment and Tools
9.14.20 Wave Solder System
9.14.21 Fluxer System
9.14.22 Measurement and Inspection System
9.14.23 Tools and Safety Equipment
9.14Materials
9.15.24 Solder Bars
9.15.25 Flux

9. Appendix 1. Wave Solder Fundamentals 21
10.15 Fluxing Step
10.16 PreHeat Step
10.17 Wave Solder Step.

10. Appendix 2. Wave Soldering Guidelines 23

11. Appendix 3. Solder Joint Criteria for SMD components. 25
12.18 Flat, Ribbon, “L” and Gull Wing Leads
12.19 Round or Flattened (CoinedLeads)
12.20 “J” Leads
12.21 Rectangular or Square End Components
12.22 Cylindrical End Cap Terminations
12.23 Bottom Only Terminations
12.24 Leadless Chip Carriers with Castellated Terminations
12.25 Butt Joints

3.
REVISIONS HISTORY

Revision
number Reason Date

# 00 First release of the procedure February...