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SPB106-WiFi 802.11b+g SMD WiFi Board

Data Sheet
SPB106 WiFi SMD Board

Data Sheet - Preliminary

SPB106 WiFi SMD Board

Revision History
Revision Revision date Description

PA1 PA2 A PB1 B PC1 PC2 PC3

2010-02-11 2010-02-17 2010-02-22 2010-02-26 2010-03-17 2010-04-12 2010-04-26 2010-06-18

First issue Updated after review Release after review and updates Info aboutSDIO interface added. FCC number corrected RF test switch information added SPIO SPI interface updated. Solder profile updated Table and figure numbering corrected

Disclaimer and copyright notice
Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OFMERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights aregranted herein.

The Wi-Fi Alliance Member Logo is a trademark of the Wi-Fi Alliance.

All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2009 H&D Wireless AB. All rights reserved.

Rev. PC3 06/2010

Data Sheet 1451-SPB106
Confidential

page 2 (23)

Data Sheet -Preliminary

SPB106 WiFi SMD Board

DATA SHEET ...................................................................................................................... 1 1
1.1 1.2

INTRODUCTION ........................................................................................................... 5
Overview......................................................................................................................................................... 5 Key Features .................................................................................................................................................. 5

2
2.1 2.2

HARDWARE ARCHITECTURE .................................................................................... 6
Block Diagram............................................................................................................................................... 6 Order information ......................................................................................................................................... 6

3
3.1 3.2 3.3 3.4 3.5 3.6

ELECTRICALDATA..................................................................................................... 7
Absolute maximum ratings ........................................................................................................................... 7 ESD ................................................................................................................................................................. 7Recommended operating conditions ............................................................................................................ 7 Power Consumption ...................................................................................................................................... 7 RF Performance............................................................................................................................................. 8 Digital pin characteristics ............................................................................................................................. 9

4
4.1 4.2

PIN CONFIGURATIONS ............................................................................................. 11
Pin Configuration...