Sony

XM-2200GTX
SERVICE MANUAL
Ver 1.0 2003. 11

US Model Canadian Model AEP Model UK Model E Model

SPECIFICATIONS
AUDIO POWER SPECIFICATIONS (US MODEL) POWER OUTPUT AND TOTAL HARMONIC DISTORTION 200 watts per channel minimum continuous average power into 4 ohms, both channels driven from 20 Hz to 20 kHz with no more than 0.1% total harmonic distortion per Car Audio Ad Hoc Committeestandards. Other Specifications
OTL (output transformerless) circuit Pulse power supply Inputs RCA pin jacks High level input connector Outputs Speaker terminals Through out pin jacks Suitable speaker impedance 2 – 8 Ω (stereo) 4 – 8 Ω (when used as a bridging amplifier) Maximum outputs 400 W × 2 (at 4 Ω) 600 W × 2 (at 2 Ω) 1,200 W (monaural) at 4 Ω Rated outputs (supply voltage at 14.4 V) 200 W × 2 (20Hz – 20 kHz, 0.1% THD, at 4 Ω) 250 W × 2 (20 Hz – 20 kHz, 0.15% THD, at 2 Ω) 500 W (monaural) (20 Hz – 20 kHz, 0.15% THD, at 4 Ω) Frequency response 5 Hz – 50 kHz ( +0 dB) –3 Input level adjustment range 0.3 – 6.0 V (RCA pin jacks) 1.2 – 12.0 V (High level input) Circuit system Low-pass filter Low boost Power requirements Power supply voltage Current drain Dimensions 50 – 300 Hz, –12 dB/oct 0 –10 dB (40 Hz) 12 V DC car battery (negative ground) 10.5 – 16 V at rated output : 48 A (at 4 Ω) Remote input : 1 mA Approx. 400 × 55 × 276 mm (15 3/4 × 2 1/4 × 10 7/8 in.) (w/h/d) not incl. projecting parts and controls Approx. 4.6 kg (10 lb. 6 oz.) not incl. accessories Mounting screws (4) High level input cord (1) Protection cap (1)

Mass Supplied accessories

Design and specifications aresubject to change without notice.

STEREO POWER AMPLIFIER
9-961-370-01
2003K04-1 © 2003. 11

Sony Corporation
e Vehicle Company Published by Sony Engineering Corporation

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XM-2200GTX

TABLE OF CONTENTS 1. GENERAL
Location and Function of Controls .......................................... 3 Connections ............................................................................. 32. DISASSEMBLY
2-1. 2-2. 2-3. 2-4. Bottom Plate ........................................................................ 7 Main Board Section ............................................................ 8 Main Board ......................................................................... 8 Led Board ............................................................................ 9

3.ELECTRICAL ADJUSTMENT .................................... 10 4. DIAGRAMS
4-1. 4-2. 4-3. 4-4. Block Diagram .................................................................. 11 Schematic Diagram –Main Section (1/2)– ........................ 12 Schematic Diagram –Main Section (2/2)– ........................ 13 Printed Wiring Boards –Main Section– ............................ 14

5. EXPLODED VIEWS5-1. Heat Sink (Main) Section .................................................. 16 5-2. Main Board Section .......................................................... 17

6. ELECTRICAL PARTS LIST ......................................... 18

Notes on Chip Component Replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged byheat.

SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNEMARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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XM-2200GTX SECTION 1 GENERAL
This section is extracted from instruction manual.

Low boost Amplification de basses fréquences
dB
10...