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Universal Serial Bus
Micro-USB Cables and Connectors
Specification

Revision 1.01
April 4, 2007

MicroUSB Specification to the USB 2.0 Specification, Revision 1.01

April 4, 2007

Revision History
Revision

Issue Date

Comment

0.6

1/30/2006

Revisions to all sections

0.7

3/24/2006

Added revised Micro-USB drawings to Rev.0.8

0.8

4/19/2006

0.8b4/26/2006

Editorial changes and additions by Jan Fahllund (Nokia)
Corrections to the 0.8 version (based by comments from contributors)

0.9

6/7/2006

Corrections based on comments from the 0.8b version

1.0RC

8/2/2006

Added lubricant recommendation, LLRC delta change specified

1.01RC

11/10/2006

1.02RC

12/10/2006

1.03RC

12/11/2006

1.0RC3

12/19/2006

Editorialchanges and addition based on Oct-06 USB-IF CCWG
meeting.
Shell material thickness tolerances changed so that material can be
0.25 mm or 0.3 mm; edited three pictures (Figure 4-10, 4-11 and 412).
Two pictures edited (Figure 4-8 and 4-9). In fig 4-8 max height to be
2.8mm MAX. In fig 4-9 R0.25mm MAX to be R0.30mm MAX.
For BoD approval

1.0

1/12/2007

Approved

1.0

1/22/2007Cosmetic edits for publication

1.01

4/4/2007

Editorial corrections and additions to contributor list. Reinserted shell
and plug material requirements as section 6.10. Clarified wording on
Plating Recommendations.

Copyright © 2007 USB Implementers Forum, Inc. (USB-IF).
All rights reserved.
A LICENSE IS HEREBY GRANTED TO REPRODUCE THIS SPECIFICATION FOR INTERNAL USE
ONLY. NO OTHERLICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, IS
GRANTED OR INTENDED HEREBY.
USB-IF AND THE AUTHORS OF THIS SPECIFICATION EXPRESSLY DISCLAIM ALL LIABILITY
FOR INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, RELATING TO IMPLEMENTATION
OF INFORMATION IN THIS SPECIFICATION. USB-IF AND THE AUTHORS OF THIS
SPECIFICATION ALSO DO NOT WARRANT OR REPRESENT THATSUCH IMPLEMENTATION(S)
WILL NOTINFRINGE THE INTELLECTUAL PROPERTY RIGHTS OF OTHERS.
THIS SPECIFICATION IS PROVIDED "AS IS" AND WITH NO WARRANTIES, EXPRESS OR
IMPLIED, STATUTORY OR OTHERWISE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED. NO
WARRANTY OF MERCHANTABILITY, NO WARRANTY OF NON-INFRINGEMENT, NO WARRANTY
OF FITNESS FOR ANY PARTICULAR PURPOSE, AND NOWARRANTY ARISING OUT OF ANY
PROPOSAL, SPECIFICATION, OR SAMPLE.
IN NO EVENTWILL USB-IF OR USB-IF MEMBERS BE LIABLE TO ANOTHER FOR THE COST OF
PROCURING SUBSTITUTE GOODS OR SERVICES, LOST PROFITS, LOSS OF USE, LOSS OF
DATA OR ANY INCIDENTAL, CONSEQUENTIAL, INDIRECT, ORSPECIAL DAMAGES, WHETHER
UNDER CONTRACT, TORT, WARRANTY, OR OTHERWISE, ARISING IN ANY WAY OUT OF THE
USE OF THIS SPECIFICATION, WHETHER OR NOT SUCHPARTY HAD ADVANCE NOTICE OF THE
POSSIBILITY OF SUCHDAMAGES.
All product names are trademarks, registered trademarks, or service marks of their respective owners.

2

MicroUSB Specification to the USB 2.0 Specification, Revision 1.01

April 4, 2007

Contributors
Mark Rodda, (editor) Motorola
Jan Fahllund, (editor) Nokia
Jim Koser, (CCWG Chairman), Foxconn
Glen Chandler, Advanced-Connectek (Acon)
Charles Wang, Advanced-Connectek (Acon)Toshinori Sasaki, Across Techno
Minoru Ohara, Allion
Brad Brown, ATL
Christopher Mattson, ATL
Marcus Darrington, ATL
Jaremy Flake, ATL Technology
George Olear, Contech Research
Roy Ting, Elka
Sophia Liu, ETC
Bill Northey, FCI
Tsuneki Watanabe, Foxconn
Jim Zhao, Foxconn
David Ko, Foxconn
Jong Tseng, Foxconn
Jack Lu, Foxlink
Tim Chang, Foxlink
Sathid Inthon, Fujikura
Toshi Mimura,Fujijura
Alan Berkema, Hewlett-Packard
Karl Kwiat, Hirose
Shinya Tono, Hirose
Kazu Ichikawa, Hirose
Ryozo Koyama, Hirose
Yousuke Takeuchi, Hirose
Tsuyoshi Kitagawa, Hosiden
Jim Eilers, Hosiden
Kazuhiro Saito, JAE
Ron Muir, JAE
Mark Saubert, JAE
Yasuhira Miya, JST
Takahiro Diguchi, JST
Yoichi Nakazawa, JST

Kevin Fang, Longwell Electronics
Morgan Jair, Main Super Co.
Tom Kawaguchi,...
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