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The Institute for Interconnecting and Packaging Electronic Circuits

IPC-2221
Generic Standard on Printed Board Design

IPC-2221
February 1998 A standard developed by the Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road Northbrook, Illinois 60062-6135 Tel Fax URL: 847 509.9700 847 509.9798 http://www.ipc.org

Supersedes IPC-D-275 September 1991Standardization

In May 1995 the IPC’s Technical Activities Executive Committee adopted Principles of Standardization as a guiding principle of IPC’s standardization efforts. Standards Should: • Show relationship to DFM & DFE • Minimize time to market • Contain simple (simplified) language • Just include spec information • Focus on end product performance • Include a feed back system on use andproblems for future improvement Standards Should Not: • Inhibit innovation • Increase time-to-market • Keep people out • Increase cycle time • Tell you how to make something • Contain anything that cannot be defended with data

Notice

IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitatinginterchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of IPC from manufacturing or selling products not conforming to such Standards and Publication, nor shall the existence of suchStandards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally. Recommended Standards and Publications are adopted by IPC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, IPC does not assume any liability to any patent owner, nor do theyassume any obligation whatever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. The material in this standard was developed by the IPC-D-275 Task Group (D-31b) of the Rigid Printed Board Committee (D-30) of the Institute for Interconnecting and Packaging ElectronicCircuits.

Copyright © 1998 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1998. Printed in the United States of America.

No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher.

IPC-2221

THE INSTITUTE

FOR

INTERCONNECTING
ANDPACKAGING

Generic Standard on Printed Board Design

ELECTRONIC CIRCUITS

Developed by the IPC-D-275 Task Group (D-31b) of the Rigid Printed Board Committee (D-30) of the Institute for Interconnecting and Packaging Electronic Circuits

Users of this standard are encouraged to participate in the development of future revisions. Contact:
IPC 2215 Sanders Road Northbrook, Illinois60062-6135 Tel 847 509.9700 Fax 847 509.9798

HIERARCHY OF IPC DESIGN SPECIFICATIONS (2220 SERIES)

IPC-2221 GENERIC DESIGN

IPC-2222 RIGID

IPC-2223 FLEX

IPC-2224 PCMCIA

IPC-2225 MCM-L

IPC-2226 HDIS

IPC-2227 DISCRETE WIRE

FOREWORD

This standard is intended to provide information on the generic requirements for organic printed board design. All aspects and details of the designrequirements are addressed to the extent that they can be applied to the broad spectrum of those designs that use organic materials or organic materials in combination with inorganic materials (metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting electronic, electromechanical, and mechanical components. It is crucial that a decision pertaining to the choice of...