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LM555
www.ti.com SNAS548B – MAY 2004 – REVISED JULY 2006

LM555 Timer
Check for Samples: LM555
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FEATURES
Direct replacement for SE555/NE555 Timing from microseconds through hours Operates in both astable and monostable modes Adjustable duty cycle Output can source or sink 200 mA Output and supply TTL compatible Temperature stability better than 0.005% per °C Normally on and normally offoutput

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Available in 8-pin MSOP package

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APPLICATIONS
• • • • • • • Precision timing Pulse generation Sequential timing Time delay generation Pulse width modulation Pulse position modulation Linear ramp generator

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DESCRIPTION
The LM555 is a highly stable device for generating accurate time delays or oscillation. Additional terminals are provided fortriggering or resetting if desired. In the time delay mode of operation, the time is precisely controlled by one external resistor and capacitor. For astable operation as an oscillator, the free running frequency and duty cycle are accurately controlled with two external resistors and one capacitor. The circuit may be triggered and reset on falling waveforms, and the output circuit can source or sink up to200mA or drive TTL circuits.

Schematic Diagram

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.
Copyright © 2004–2006, Texas InstrumentsIncorporated

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

LM555
SNAS548B – MAY 2004 – REVISED JULY 2006 www.ti.com

Connection Diagram
Dual-In-Line, Small Outline and Molded Mini Small Outline PackagesFigure 1. Top View
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings
Supply Voltage Power Dissipation LM555CMM Operating Temperature Ranges LM555C Storage Temperature Range Soldering Information Dual-In-Line PackageSoldering (10 Seconds) Small Outline Packages (SOIC and MSOP) Vapor Phase (60 Seconds) Infrared (15 Seconds)
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(1)

+18V 1180 mW 613 mW 0°C to +70°C −65°C to +150°C

LM555CM, LM555CN (3)

260°C

215°C 220°C

See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. (1) Absolute Maximum Ratings indicate limitsbeyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are notguaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. For operating at elevated temperatures the device must be derated above 25°C based on a +150°C maximum junction temperature and a thermal resistance of 106°C/W (DIP), 170°C/W (S0-8), and 204°C/W (MSOP) junction to ambient. Refer to RETS555X drawing of military LM555H and LM555Jversions for specifications.

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Copyright © 2004–2006, Texas Instruments Incorporated

LM555
www.ti.com SNAS548B – MAY 2004 – REVISED JULY 2006 (1) (2)

Electrical Characteristics
Parameter

(TA = 25°C, VCC = +5V to +15V, unless othewise specified)
Conditions Min Supply Voltage Supply Current VCC = 5V, RL = ∞...