Manual Sniper Iii

Automated Production Equipment, Inc.

Sniper II SMT/BGA/Chip Scale Placement and Rework System
7007-5001

OPERATOR’S MANUAL
Revision XVI January 25, 2002

©2000 Automated Production Equipment (A.P.E.) Inc., all rights reserved. For additional copies of this manual, contact the company at 48 Coral Way, MM 105.2, Key Largo, FL 33037, Tel. (305) 451-4722, Fax (305) 451-3374, emailsales@ape.com, web address www.ape.com.

IMPORTANT! PLEASE READ THE FOLLOWING STATEMENT
The responsible body shall be made aware that if the equipment is used in a manner not specified by the manufacturer, the protection provided by the equipment may be impaired.

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1. Introduction 2. Getting Acquainted 3. Installation, Setup and Vision Test Operation 4. Reflow Setup and Reflow Test Operation 5.Power Up and Test Routine 6. Board Holder, Nozzle Selection and Rework Procedure

7. 8100-P300 Profile Pattern Recipe Controller (PPR), 7A Bottom Heater Controller 8. Rework Cautions 9. Reflow Calibration 10. DABIS (Prism) Alignment Procedure 11. Environmental Information 12. Maintenance Information 13. Technical Specification 14. Computer Graphical Interface Software Installation and Practice15. Reflow Controller 8100-P300 Technical Specification 16. Appendix A 17. Hot Surface Symbol Explanation 18. Engineer Test Procedures 19. Appendix B Bottom and Top Heater Coil Replacement Procedure 1. INTRODUCTION The A.P.E. SNIPER IITM SMD-7007-5001 combines precision visual alignment with top and bottom preheat/reflow for complete rework processing of SMT, BGA, and ChipScale components. TheSNIPER II is the next generation of rework systems, designed for the new world of chip-scale packages, as well as traditional fine-pitch SMDs. Its split-

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vision alignment utilizes the latest technology in optical engineering and alignment design. It provides absolute control in positioning all ultra-fine pitch QFP, CSP, and µBGA components, together with large ceramic or plastic BGA devices.The heart of the vision system is the Dichroic Alignment Beam Image Splitter (DABIS), a contemporary innovative refinement in imaging dual fields to enhance and complement the processed image. The heating system incorporates all the best features of the popular and proven FloMasterT M high power/low temperature rework system, providing controllable top and bottom heating, preheating capability, andthe ability to create, store, and run thermal profiles, recreating those used in the initial manufacture of the circuit assembly. Using the SNIPER II, an operator may remove a defective component, accurately position a replacement component within an accuracy of +/- 0.001”, and safely solder attach that new component to the PCB. The ability to preset positioning parameters, as well as to createand store complex thermal profiles, ensures precise repeatable processing and a robust process, component after component, and board after board. Therefore the SNIPER II brings together two powerful systems - the Sniper II placement unit with its DABIS split imaging optics, and the Sniper II heating and rework system, to create one complementary synchronous unit - the SNIPER IIT M SMD-7007-5001.This manual is designed and intended for personnel actually using the SNIPER II, and contains an overview of the machine itself, how to unpack, inspect, assemble, and power up the unit. It also contains a brief overview of the rework process, and how to use the SNIPER II to remove and replace defective components, and how to accomplish light assembly. The operator will learn how to create, test,store, retrieve, and modify thermal profiles for removal, and to program the controller. If you have questions regarding the use of the machine that are not answered in the manual, contact the A.P.E. factory at (305) 451-4722 or email techsupport@ape.com. We would appreciate your comments, and they will help us create a better manual for you, your co-workers, and your colleagues in the field....