Sistemas de puesta a tierra

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SISTEMA DE TIERRA FISICA MAGNETOACTIVO
EL SISTEMA DE TIERRA FISICA MAGNETOACTIVO TOTAL GROUND ofrece el mejor
desempeño para aterrizar equipo Electrónico, Telecomunicaciones y todo equipo sensible, el
COPLAGROUND (Sincronizador de impedancias y Acoplamiento a Masas ) en conjunto con EL
ELECTRODO MAGNETOACTIVO UNIDIRECCIONAL protege cualquier tipo de equipo , un
sistema puede reemplazarvarios electrodos de cobre convencionales o químicos y es ideal para
consideraciones de espacio.
1. El SISTEMA DE TIERRA FISICA CON DISPOSITIVO MAGNETOACTIVO.
Provee la perfecta interface de baja resistencia permanentemente en cualquier tipo de terreno.
2. Ultra-Baja Resistencia menos de 2 Ohms
3. Disipa efectivamente corrientes de Pararrayos y Falla de corrientes.
4. Con varios modelos Standarddisponibles, EL SISTEMA DE TIERRA FISICA
MAGNETOACTIVO cumple cualquier requerimiento.
5. El gabinete Cumple UL
Los materiales y procesos del Sistema de Tierra Física Magnetoactivo esta diseñados para
cumplir los siguientes estándares:
IEEE STD 1100-1999 Recommended Practice for Powering and Grounding Electronic Equipment
IEEE STD 142-1991 Recommended Practice for Electric Power System inCommercial Buildings.
MIL-HDBK-419A Military Hand Book Grounding, Bonding and Shielding for Electronic Equipment
and Facilities.
NOM-001-SEDE 1999, NEC 250-51
APLICACIONES
• Naves de Manufactura-Comercial/Industrial
• Edificios Comercial, Oficinas, Clínicas, Hospitales, Etc.
• En Sistemas de Telecomunicaciones junto con Barra de Tierras
• Para cualquier punta de Pararrayos
• AplicacionesMilitares
• En cualquier parte donde se requiera o necesite PERFECTO
ATERRIZAMIENTO
2.2.2 Resistance to Earth. Metal underground water pipes Typically exhibit a resistance to earth of less than TWO ohms.
Other metal elements in contact with the soil such as the metal Frame of the building, underground gas piping systems, well casings,
other piping and/or buried tanks, and concrete-encased steelreinforcing bars or rods in underground footings or foundations generally
exhibit a resistance substantially lower than 25 ohms.
2.2.2.1 National Electrical Code Requirements. For the fault protection subsystem, the NEC (2-2) states in Article 250 that a single
electrode consisting of a rod, pipe or plate hich does not have a resistance to ground of 25 ohms or less shall be augmented by oneadditional made electrode. Although the language of the NEC clearly implies that electrodes with resistances as high as 25 ohms are to
be used only as a last resort, this 25 ohm limit has tended to set the norm for grounding resistance regardless of the specific system
needs.
The 25 ohm limit is reasonable or adequate for application to private homes and other lower powered type facilities.MILITARY HANDBOOK
GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND
FACILITIES VOLUME 1 OF 2 VOLUMES BASIC THEORY
IEEE Std 142-1991
(Revision of IEEE Std 142-1982)
IEEE Recommended Practice for Grounding of Industrial and Commercial Power
Systems
Sponsor
Power Systems Engineering Committee of the IEEE Industry Applications Society
Approved June 27, 1991
IEEE Standards BoardApproved December 9, 1991
American National Standards Institute
5.2 Definitions
It must be noted that contrary to popular notion, the National Electrical Code (NEC) [1] does not favor the use of ground
rods.
Section 250-81 [1]21 states that if the following items are available, they are to be used first and bonded together to form
the grounding ectrode system:
1) Metal underground water pipe2) Metal frame of the building, where effectively grounded
3) Concrete-encased electrode
4) Ground ring
Section 250-83 states that if none of the above is available, then and only then can you use any of the following:
1) Other local metal underground systems or structures
2) Rod and pipe electrodes
3) Plate electrodes
One of the most effective ground electrode systems is a ground ring...
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