Limites De Profundidad

L3G4200D
MEMS motion sensor: three-axis
digital output gyroscope
Preliminary data

Features
■

Three selectable full scales (250/500/2000
dps)

■

I2C/SPI digital output interface

■

16 bit-rate value data output

■

8-bit temperature data output

■

Two digital output lines (interrupt and data
ready)

■

Integrated low- and high-pass filters with userselectablebandwidth

Description

■

Embedded self-test

■

Wide supply voltage: 2.4 V to 3.6 V

The L3G4200D is a low-power three-axis angular
rate sensor.

■

Low voltage-compatible IOs (1.8 V)

■

Embedded power-down and sleep mode

■

Embedded temperature sensor

■

96 levels of 16-bit data output (FIFO)

■

High shock survivability

■

Extended operating temperaturerange (-40 °C
to +85 °C)

■

ECOPACK® RoHS and “Green” compliant

LGA-16 (4x4x1.1 mm)

Applications
■

Gaming and virtual reality input devices

■

Motion control with MMI (man-machine
interface)

■

GPS navigation systems

■

Appliances and robotics

Table 1.

It includes a sensing element and an IC interface
capable of providing the measured angular rate to
theexternal world through a digital interface
(I2C/SPI).
The sensing element is manufactured using a
dedicated micro-machining process developed by
STMicroelectronics to produce inertial sensors
and actuators on silicon wafers.
The IC interface is manufactured using a CMOS
process that allows a high level of integration to
design a dedicated circuit which is trimmed to
better match the sensingelement characteristics.
The L3G4200D has a full scale of ±250/±500/
±2000 dps and is capable of measuring rates with
a user-selectable bandwidth.
The L3G4200D is available in a plastic land grid
array (LGA) package and can operate within a
temperature range of -40 °C to +85 °C.

Device summary

Order code

Temperature range (°C)

Package

Packing

L3G4200D

-40 to +85

LGA-16(4x4x1.1 mm)

Tray

L3G4200DTR

-40 to +85

LGA-16 (4x4x1.1 mm)

Tape and reel

September 2010

Doc ID 17116 Rev 2

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.

1/29
www.st.com

29

Contents

L3G4200D

Contents
1

Block diagram and pin description . . . . . . . . . . . .. . . . . . . . . . . . . . . . . 6
1.1

2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Mechanical and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1

Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.2

Electricalcharacteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.3

Temperature sensor characteristics

2.4

Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.4.1

SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

2.4.2

I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.5

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.6

Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.6.1
2.6.2

3

Zero-rate level . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2.6.3

2.7

Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ....