29 DECEMBER 1987
21 JANUARY 1982
GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES
VOLUME 1 OF 2 VOLUMES BASIC THEORY
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited
DEPARTMENT OF DEFENSE WASHINGTON DC 20301
MIL-HDBK-419A GROUNDING,BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES 1. established 2. This standardization handbook was developed by the Department of Defense in accordance with procedure. This publication was approved on 29 December 1987 for printing and inclusion in the military Vertical lines and asterisks are not used in this revision to identify changes
standardization handbook series.
withrespect to the previous issue due to the extensiveness of the changes. 3. This document provides basic and application information on grounding, bonding, and shielding It will provide valuable information and guidance to
practices recoin mended for electronic equipment.
personnel concerned with the preparation of specifications and the procurement of electrical and electronic equipment forthe Defense Communications System. The handbook is not intended to be referenced in purchase specifications except for informational purposes, nor shall it supersede any specification requirements. 4. Every effort has been made to reflect the latest information on the interrelation of considerations It is the intent to review this
of electrochemistry , metallurgy, electromagnetic, andatmospheric physics.
handbook periodically to insure its completeness and currency. Users of this document are encouraged to report any errors discovered and any recommendations for changes or inclusions to: Commander, 1842 EEG/EEITE, Scott AFB IL 62225-6348. 5. Copies of Federal and Military Standards, Specifications and associated documents (including this Commanding Officer, Naval Publications andForms Center, 5801 Copies of industry association documents should be
handbook) listed in the Department of Defense Index of Specifications and Standards (DODISS) should be obtained from the DOD Single Stock Point: Tabor Avenue, Philadelphia PA 19120. obtained from the sponsor. Single copies may be obtained on an emergency basis by calling
(AUTOVON) 442-3321 or Area Code (215)-697-3321.activity or as directed by the contracting officer.
Copies of all other listed documents should be obtained from the contracting
This volume is one of a two-volume series which sets forth the grounding, bonding, and shielding theory for communications electronics (C-E) equipments and facilities. Grounding, bonding, and shielding are complex subjects about which in the pastthere has existed a good deal of misunderstanding. The subjects themselves are interrelated and involve considerations of a wide range of topics from electrochemistry and metallurgy to electromagnetic field theory and atlmspheric physics. These two volumes reduce these varied considerations into a usable set of principles and practices which can be used by all concerned with, and responsible for,the safety and effective operation of complex C-E systems. Where possible, the Principles are reduced to specific steps. Because of the large number of interrelated factors, specific steps cannot be set forth for every possible situation. However, once the requirements and constraints of a given situation are defined, the appropriate steps for solution of the problem can be formulated utilizingthe principles set forth. Both volumes (Volume I, Basic Theory and Volume II, Applications) implement the (Grounding, Bonding, and Shielding requirements of MIL-STD-188-124A which is mandatory for use within the Department of Defense. The purpose of this standard is to ensure the optimum performance of ground-based telecommunications equipment by reducing noise and providing adequate protection...