Polyamide

Professional Manufacturer in Copper Clad Laminates

Ventec
UL Approval: E214381 Version : Rev. 5

VT-901
Datasheets & Process Guideline
VT-901TC /Laminate VT-901PP/Prepreg

High Tg & HighReliability Material

General Information
High Tg (Tg 250℃) and Extreme Operating Temperature High Thermal Resistance(Td 390℃) and Several Assembly Processing Improved Fracture Toughness Low Z-axisCTE for Through Hole Reliability

Application
Chip Manufacturers Engine/Flight Controls Down Hole Power Supply /Backplane

Military and Burn-in Board

Availability
VT-901TC Laminates areavailable in thickness from .004” to .125” and with the copper foil from 1/2oz to 3oz; Ventec can supply double side treated copper foil and single side treated copper foil, but double side treated copperfoil and reverse copper foil are not suggested using on VT-901 laminates because the peel strength would not be as good as conventional material’s. VT-901PP pre-pregs are available in many E-Glassstyles, such as 7628, 7629, 1506, 1500, 2113, 2313, 3313, 2116.

Storage Condition & Shelf Life
Prepreg Storage Condition Shelf Life
Temperature Relative Humidity Below 20℃(68℉) Below 50% RH 3 MonthsRoom / 5 Months(airproof)

Laminate

* The pre-preg exceeding shelf time should be retested.

Ventec Electronics (Suzhou) Co., Ltd 168 Xiang Yang Rd., Suzhou New District Jiangsu, P.R. China215009 Page 1 of 3
Issued: Jan-2009

Telephone: +86 512 6809 1810 Fax: +86 512 6808 1823 E-mail: sales@ventec.com.cn

Professional Manufacturer in Copper Clad Laminates

Ventec

VT-901Properties Sheet: IPC-4101B Specification Sheet(s)/41、 42
Test Item
Flexural Strength Peel Strength (1 oz) Warp Fill As Received After Thermal stress 2.4.25 ASTM D3850 TMA Before Tg After Tg Z-axis TotalExpansion Moisture Absorption Volume Resistance Surface Resistance Electric Strength Dielectric Breakdown Arc Resistance 1.0 MHz Dielectric Constant (Dk) 1.0 GHz 2.0 GHz 1.0 MHz 1.0 GHz 2.0 GHz...