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NANYA Module Part Numbering Guide
NT NANYA Technology Module Density
256=256MB 512=512MB 1G=1GB 2G=2GB 4G=4GB 8G=8GB 16T=16GB (Stacking) 32T=32GB (Stacking)

4GT

T

64

U

8

H

B0

U

N

AC Speed
DDR2 SDRAM 5A=PC2-3200-3-3-3 37B=PC2-4200-4-4-4 3C=PC2-5300-5-5-5 25C=PC2-6400-5-5-5 25D=PC2-6400-6-6-6 **2C=PC2-6400-5-5-5 **2D=PC2-6400-6-6-6 DDR3 SDRAM AC=PC3-6400-5-5-5AD=PC3-6400-6-6-6 BE=PC3-8500-7-7-7 BF=PC3-8500-8-8-8 CF=PC3-10600-8-8-8 CG=PC3-10600-9-9-9 DG=PC3-12800-9-9-9 DH=PC3-12800-10-10-10 DI=PC3-12800-11-11-11

Product Family
D=DDR SDRAM C=DDR3 SDRAMT=DDR2 SDRAM

Data Width
64=x64 72=x72

Interface & Power (Vdd & Vddq)
S=SSTL-2 (2.5V, 2.5V) U=SSTL-18 (1.8V, 1.8V) B=SSTL-15 (1.5V, 1.5V) C=SSTL-13 (1.35V, 1.35V)

Module Type CompositionComponent
4=x4 based H=x16 based 8=x8 based RoHS + Halogen Free S=SO-DIMM J=DDR3 RDIMM/TI K=DDR3 RDIMM/IDT L=DDR3 RDIMM/Inphi P=DDR2 FBD/RDIMM F=Unbuffered DIMM or UECC RoHS V=DDR2 RDIMM Y=Unbuffered DIMMN=SO-DIMM or FBDIMM (Intel AMB)

Number of Component
4=4 ea 8=8 ea 9=9 ea H=16 ea P=18 ea N=36 ea

Die Generation
A=1st Version B=2nd Version C=3rd Version D=4th Version E=5th Version F=6thVersion G=7th Version

Package Code
RoHS + Halogen Free S=TSOP (II) N=78-Ball BGA P=96-Ball BGA E=60-Ball BGA J=68-Ball BGA M=92-Ball BGA U=71-Ball BGA Y=63-Ball BGA G=DDR1 BGA / DDR2 84-Ball BGA RoHS5 B=60-Ball BGA H=68-Ball BGA L=92-Ball BGA F=84-Ball BGA T=SDR 54-Pin TSOPII/DDR 66-Pin TSOPII

Module Revision · UDIMM: rev. of PCB & Type · SODIMM: w/ or w/o Thermal Sensor, rev. of PCB & Type ·UDIMM w/ ECC: rev. of PCB & Type · RDIMM: w/ or w/o Heat Sink, rev. of PCB & Type · FBDIMM: rev. AMB, PCB, & Heat Sink

** FBDIMM only

NANYA Component Part Numbering Guide
NT NANYA TechnologyProduct Family
5S=SDRAM 5D=DDR SDRAM 5T=DDR2 SDRAM 5C=DDR3 SDRAM

5T

U

256T8

B

U

25C Speed
SDRAM 75B=PC-133-3-3-3 6K=PC-166-3-3-3 DDR SDRAM 75B=DDR266 6K=DDR333 5T=DDR400 DDR2...
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