Usb complete 4. edition by jan axelson

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Lakeview Research LLC Madison, WI 53704

USB Complete: The Developer’s Guide, Fourth Edition by Jan Axelson Copyright 1999-2009 by Janet L. Axelson All rights reserved. No part of the contents of this book, except the program code, may be reproduced or transmitted in any form or by any means without the written permission ofthe publisher. The program code may be stored and executed in a computer system and may be incorporated into computer programs developed by the reader. The information, computer programs, schematic diagrams, documentation, and other material in this book are provided “as is,” without warranty of any kind, expressed or implied, including without limitation any warranty concerning the accuracy,adequacy, or completeness of the material or the results obtained from using the material. Neither the publisher nor the author shall be responsible for any claims attributable to errors, omissions, or other inaccuracies in the material in this book. In no event shall the publisher or author be liable for direct, indirect, special, incidental, or consequential damages in connection with, or arising outof, the construction, performance, or other use of the materials contained herein. Many of the products and company names mentioned herein are the trademarks of their respective holders. PIC and MPLAB are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. PICBASIC PRO is a trademark of Microchip Technology Inc. in the U.S.A. and other countries. Published byLakeview Research LLC, 5310 Chinook Ln., Madison WI 53704 www.Lvr.com Distributed by Independent Publishers Group (ipgbook.com). 14 13 12 11 10 9 8 7 6 5 4 3 2 1

Printed and bound in the United States of America ISBN13 978-1-931448-08-6

Contents

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7UGU CPF .KOKVU                            Benefits for Users . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Benefits for Developers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 What USB Can’t Do . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 USB versus Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 USB versus IEEE-1394. . . . . . . . . . . . . . . . . .. . . . . . . . . . . . 11 'XQNWVKQP QH CP +PVGTHCEG                      USB 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 USB 1.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 USB 2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 USB 3.0 . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 USB On-The-Go . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Wireless USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

iii

$WU %QORQPGPVU                           Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . 15 Bus Speed Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 &KXKUKQP QH .CDQT                            The Host’s Duties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 The Device’s Duties. . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . 22 Bus Speeds and Data Throughput . . . . . . . . . . . . . . . . . . . . . 24 &GXGNQRKPI C &GXKEG                         Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Tools for Developing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Steps in Developing a Project . . . . . . . . ....
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